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With the trend toward smaller, higher-density designs, integration, and versatility in electronics, protection from drop impacts, thermal shock, water vapor, and other factors that can damage electronics is critical to their long-term reliability. Bottom filling has gradually become a necessary protection and reinforcement process for high-reliability electronic products.

We can offer bottom-fill solutions ranging from capillary flow materials for BGA, CSP, PoPS, LGA and WLCSP to fillers that improve flip-chip reliability to meet all device reinforcement and reinforcement requirements.

For applications that do not require a full bottom fill, Cornerbond and Edgebond technologies are more cost-effective solutions that provide strong perimeter reinforcement and automatic positioning capabilities.

At the same time, it can provide Non-reworkable underfill, reworkable underfill and Reflow resistance underfill solutions.